Dear International Students and Professionals,

To help Taiwan’s semiconductor industry expand its international talent network, the 2026 Taiwan Semiconductor Career Day will be held on Friday, June 5, 2026, at National Chung Cheng University.

This event is organized under the Semiconductor International Linkage and Innovation Empowerment Program of the Industrial Development Administration. It aims to connect international STEM students and semiconductor-related professionals with leading companies in Taiwan’s semiconductor industry.

Participating companies include Siliconware Precision Industries Co., Ltd. (SPIL), Winbond Electronics, Himax Technologies, Chipbond Technology, and ASE Technology Holding Co. Company representatives will be on site to introduce their businesses, share career opportunities, and meet with participants through one-on-one interviews and networking sessions.

This is a valuable opportunity for international students and professionals to gain a deeper understanding of Taiwan’s semiconductor industry, explore potential career paths, and connect directly with major semiconductor employers.

Event Details
Event: 2026 Taiwan Semiconductor Career Day
Date: Friday, June 5, 2026
Time: 1:00 PM – 4:00 PM
Check-in: 12:30 PM – 1:00 PM
Venue: Banquet Hall, 3F, East Wing of the Administration Building, National Chung Cheng University
Participating Companies: SPIL, Winbond Electronics, Himax Technologies, Chipbond Technology, ASE Technology Holding Co.
Program: Company presentations, recruitment sharing, and one-on-one interviews
Target Participants: International students in STEM-related fields who are approaching graduation, as well as international talents who have graduated and have semiconductor-related experience
Registration: (click here to register)